Products Desc.
A 1032 SMD fuse refers to a surface-mount fuse with the package size of 10.0 mm x 3.2 mm (L x W). This type of fuse is designed to be mounted directly onto a printed circuit board (PCB) and is commonly used to protect sensitive electronic components from overcurrent or short-circuit events.
SMD fuses are widely used in a variety of electronic applications, such as power supplies, telecommunication equipment, automotive electronics, and consumer electronics.
Features of 1032 Brick SMD Fuse
1. Size: The 1032 SMD fuse measures 10 mm x 3.1 mm x 3.1 mm (L x W x H).
2. Response Time: The response time of a fuse refers to the time it takes for the fuse to blow or open the circuit after it has reached its current rating. The response time of the 1032 SMD fuse is typically a few milliseconds.
3. Reliable Operation: The 1032 SMD fuse is a reliable and cost-effective solution for protecting electronic circuits from overcurrent or short-circuit events. It is designed to operate within a specific temperature range, which ensures its performance and longevity.
4. Space-saving: The 1032 SMD fuse is designed to be mounted directly onto a PCB, which saves space and simplifies the overall design of the electronic circuit.
Product Parameter
| Product name: | SMD Chip Fuse 1032 | Size: | 10 mm x 3.1 mm x 3.1 mm (L x W x H) |
|
Rated Voltage: |
250V AC | Rated Current: |
500mA to 10A |
|
Operating Temperature:
|
-55℃ To 125℃ | Type: | Time Lag |
| Pacakge: | 1031 1032 | Cap: | Silver Plated Brass |
| Body: | Ceramic Tube | Packing: | Tape |
Recommended Customer Soldering Parameters
|
Reflow Condition |
Pb-Free assembly |
|
|---|---|---|
|
Preheating |
-Temperature Min TS(min)
|
150℃ |
|
-Temperature Max TS(man)
|
200℃ | |
|
-Time Max
|
120 secs | |
|
Soldering |
-Temperature(TL)(Liquidus)
|
260℃ |
|
-Time Max(TL)
|
60 secs | |
|
-Temperature(TP)
|
Max 260℃ | |
|
-Time Max(TP)
|
10 secs | |
Products Dimension
Products Characteristic
| NO. | Item | Contain | Reference standard |
|
1 |
Insulation Resistance | 10,000 ohms minimum | MIL-STD-202G, Method 302 Test ConditionA |
| 2 | Solderability | 10,000 ohms minimum | MIL-STD-202G, Method 208H |
| 3 | Resistance to Soldering Heat | 10 sec at 260℃ | MIL-STD-202G, Method 210F Test Condition B |
| 4 | Thermal Shock | 5 cycles, -65℃ to 125℃, 15minutes @each extreme | MIL-STD-202G, Method 107G Test Condition B |
| 5 | Mechanical Shock | 100G’s peak for 6 milliseconds, 3 cycles | MIL-STD-202G, Method 213B Test 1 |
| 6 | Vibration | 0.03” amplitude, 10-55 Hz in 1 min. 2hrs each XYZ=6hrs | MIL-STD-202G, Method 201A |
| 7 | Moisture Resistance | 10 cycles | MIL-STD-202G, Method 106G |
| 8 | Salt spray | 48hrs | MIL-STD-202G, Method 101E Test Condition B |
Electrical Characteristic
|
Ampere Rating
|
% of Ampere Rating
|
Opening Time
|
|
200mA - 10A |
100% | 4 hours, Min. |
| 250% | 120s, Max. |
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